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10hx26wto 256 to 263 mounted devices extruded heat sink aluminum extrusion smd dpak d2pak heatsink-0

Electronic Heat sink

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10(H)x26(W)TO-256 TO-263 Mounted Devices Extruded Heat Sink Aluminum Extrusion SMD-Dpak-D2pak Heatsink

  • Increased surface area for enhanced thermal performance.
  • Features a lighter aluminum construction.
  • Curved-mounted tin plated solderable rods maximize thermal conduction efficiency.
  • Available in reel packaging.
  • Suitable for TO-252, TO-263, and TO-268 packages. 
  • The best thermal management options for DPAK or D2PAK device.
Product Description



Width(mm) Height(mm) Length(mm)
To-252 25.9 10.2 12.7
To-263 25.9 10.2 12.7
To-268 30.9 10.2 12.7

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