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Our company's heat pipe radiators provide a high-efficiency solution for addressing thermal management challenges in mid-to-high-end equipment. Based on the principle of two-phase flow phase-change heat transfer, they achieve an extremely high equivalent thermal conductivity far surpassing solid metals through the synergistic interaction of internal capillary structures and working fluids. This enables instantaneous, rapid, and uniform diffusion of heat from point or line heat sources across the entire fin array.
Core Advantages:
· Efficient Heat Transfer, Overcoming Bottlenecks: Heat pipe thermal efficiency reaches tens of times that of pure copper, rapidly eliminating localized thermal bottlenecks and significantly reducing core chip junction temperatures.
· Exceptional Temperature Uniformity, Stable and Reliable: Outstanding temperature leveling effectively eliminates hotspots within the system, substantially enhancing the long-term operational stability and lifespan of electronic components.
· Flexible Design, Space-Saving: Heat pipes can be bent or flattened to accommodate spatial constraints, enabling optimized 3D layout—ideal for building efficient cooling systems in compact devices.
· Powerful Modularity for High Power Applications: Our mastery of precision processes like fin-through and reflow soldering ensures minimal interfacial thermal resistance, enabling the creation of robust cooling modules capable of handling hundreds of watts of ultra-high power dissipation.
Our heat pipe coolers are the ideal thermal solution for high-performance applications including servers/data centers, high-end GPU graphics cards, communication base stations, industrial lasers, and electric vehicle control systems.
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