As a core solution for high-power equipment thermal management, our company's Liquid Cold Plate delivers efficient and stable cooling performance for high heat flux density scenarios through innovative flow channel design and precision manufacturing. Crafted from premium metal substrates (such as aluminum, copper, or stainless steel) through precision machining, the product integrates optimized microchannels or turbulent flow structures internally. Combined with a high-thermal-conductivity interface design, it achieves over 50% higher heat exchange efficiency than traditional cooling solutions. This enables rapid dissipation of concentrated heat generated by high-power electronic components, ensuring stable and controllable temperatures for equipment under demanding operating conditions.
Leveraging integrated molding and sealing technology, the liquid cooling plate delivers outstanding leak resistance and structural reliability. It withstands high pressure and corrosion, compatible with various coolants including water and ethylene glycol. The product supports flexible customization, allowing adjustments to dimensions, flow channel layout, interface types, and surface treatment processes according to customer requirements. It perfectly accommodates various high-power equipment such as new energy vehicles, energy storage systems, industrial power supplies, and server clusters. Combining compact structure, low flow resistance loss, and long-lasting durability, our liquid cooling plate breaks through thermal bottlenecks for your products, fortifying the core defense for stable operation.


