Copper extruded heat sinks represent one of the most widely adopted and technologically mature thermal solutions in modern electronics cooling. With their exceptional thermal conductivity, outstanding reliability, and high design flexibility, they serve as the ideal thermal management choice for diverse devices ranging from high-power CPUs and GPUs to LED lighting and power supply modules.
Advantages:
Unparalleled Thermal Conductivity: Pure copper boasts a thermal conductivity of up to 401 W/(m·K), far exceeding most metallic materials. This enables rapid and uniform heat transfer from heat sources (such as chips) to every fin of the radiator, significantly enhancing overall cooling efficiency.
Mature Manufacturing Process: The extrusion process forces heated copper billets through precision dies under immense pressure, forming complex heat sink structures in a single operation. This technique offers proven reliability, high production efficiency, and cost control, making it ideal for large-scale standardized manufacturing.
Robust Durability and Stable Performance: Extruded copper heat sinks feature dense structures with exceptional mechanical strength and corrosion resistance. Their thermal performance remains stable under prolonged high-temperature conditions, ensuring continuous and reliable operation of electronic devices.
Flexible Design Adaptability: By changing dies, heat sinks of varying dimensions, fin heights, densities, and shapes can be produced to accommodate diverse applications—from compact spaces to high-heat-dissipation requirements. Fins can be designed thinner and denser to increase heat dissipation surface area, maximizing cooling efficiency within limited space.
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