Communications and Data Centers

With the advancement of 5G, cloud computing, artificial intelligence and big data, the computational and transmission loads of communication equipment and data centers have surged rapidly. As chip power density continues to rise, thermal management has become one of the core challenges in system design. Whether it concerns the RF power amplifier modules and optical modules within 5G base stations, or the CPUs, GPUs, and switching chips in data centers, efficient thermal management within confined spaces is essential to ensure long-term stable operation. Inadequate thermal design can lead to excessive device junction temperatures, resulting in performance degradation, increased failure rates, reduced lifespan, and even system outages, causing substantial economic losses.

Typical thermal management challenges for communication equipment include: compact form factors, high power density, and limited cooling space; complex installation environments where outdoor base stations endure extreme temperature cycles, precipitation, dust, and salt spray; the requirement for base station equipment to operate continuously without interruption, demanding highly reliable, maintenance-free cooling solutions; alongside considerations for weight, cost, and energy consumption to reduce operators' total cost of ownership (TCO). Data centers face challenges such as complex airflow organisation within racks, pronounced localised hotspots, and high fan energy consumption, necessitating a balance between thermal efficiency and PUE (Power Usage Effectiveness).

Multiple thermal management solutions can be employed for different application scenarios in telecommunications and data centers. For 5G base station power amplifiers and AAUs (Active Antenna Units), heat pipes or heat spreaders combined with Skived Fin heat sinks are commonly employed. These rapidly and uniformly distribute chip heat to the fins, which then dissipate it via natural convection. For outdoor high-power equipment, finned heat sinks or die-cast monolithic heat sinks can be designed, with surface anodising or coating treatments enhancing corrosion resistance. Data centre servers typically employ forced air cooling designs combining heat sinks with fans, where pin-fin heat sinks are widely adopted for their omnidirectional heat dissipation and high thermal efficiency. For high-performance computing (HPC) and AI training clusters, liquid cooling solutions are increasingly prevalent. These utilise cold plates to directly transfer heat into a circulating liquid system, significantly reducing junction temperatures and fan power consumption.