Chip heat sinks are exceptional thermal conductive materials. Their high thermal conductivity facilitates the transfer of heat generated by chips or components to heat dissipation fins for release. The design feature of chip heat sinks lies in increasing the fin surface area, thereby achieving more efficient heat dissipation.
The most commonly used materials for chip heat sinks are aluminum and copper. Aluminum boasts a thermal conductivity as high as 235 W/m-K. The higher the thermal conductivity, the stronger the heat transfer efficiency.
Chip heat sinks offer lightweight properties, reducing installation stress on motherboards. Aluminum chip heat sinks feature lower production costs. They deliver efficient thermal solutions while helping you save on your budget.
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