BGA heat sinks are critical thermal management components specifically engineered for highly integrated chips utilising ball grid array packaging. With the rapid advancement of electronic device performance, the power consumption and heat generation of core chips such as CPUs, GPUs, and FPGAs have increased dramatically. BGA heat sinks ensure sustained, stable operation within safe temperature parameters by efficiently conducting and dissipating heat generated during chip operation into the surrounding environment. They serve as the core safeguard against device throttling, stuttering, or even damage caused by overheating.
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