Home > Products > Heat sink Technologies > Cold forge Heat sink
Cold forging can easily achieve fin thicknesses as low as 0.2mm or even thinner, along with fin spacings below 0.5mm—features unattainable through extrusion processes.
· Fin Height: Capable of producing very tall fins, providing substantial heat dissipation surface area.
· Base Thickness: Can be designed with a robust base tailored to heat source requirements, serving as a “heat reservoir” and facilitating heat equalization.
· Monolithic Structure: Ensures minimal thermal resistance, guaranteeing high performance.
· Fin Geometry: By employing specialized cutting tools and motion trajectories, non-planar fin shapes can be created that actively enhance heat dissipation.
Primary Applications for Cold-Forged Heatsinks:
1. High-end computers and servers
· CPU/GPU coolers: Critical for ensuring stable operation of server CPUs and workstation graphics cards with extremely high TDP (Thermal Design Power).
· Chipset and VRM cooling: Increasingly demanding thermal management for motherboard power delivery modules drives adoption of compact, high-efficiency cold-forged heat sinks.
2. Communication Equipment
· 5G base stations require efficient thermal solutions for numerous high-frequency, high-power chips, making cold-forged heat sinks an ideal choice.
3. Aerospace and Military Electronics
· These sectors demand exceptional equipment reliability, vibration resistance, and thermal efficiency. Cold-forged heat sinks perfectly meet these requirements with their monolithic structure and superior performance.
4. High-End Graphics Cards
· Many flagship graphics cards incorporate cold-forged heat spreader bases or auxiliary fins within their cooling modules.
EN
