Copper heat sinks are thermal management devices primarily constructed from copper. Leveraging copper's high thermal conductivity, they rapidly dissipate heat to ensure equipment operates normally.
Performance characteristics: Copper's thermal conductivity is 401 W/(m·K), approximately 1.7 times that of aluminum, enabling swift heat transfer from the heat source to the cooling fins. Its specific heat capacity is only half that of aluminum, allowing for faster temperature changes after heat absorption, making it suitable for rapid heat transfer scenarios. However, copper's density is over three times that of aluminum, resulting in significantly greater weight for the same volume. Additionally, copper's higher cost contributes to the relatively higher price of copper heat sinks.
Common Types: These include copper heat sink fins, copper radiators, and copper cold plates. Individual copper fins typically measure 0.1-0.3mm thick and are bonded to a substrate via welding or fin-through processes for use in air-cooled heat sinks. Copper radiators consist of copper tubes and fins, employed in liquid cooling systems. Copper cold plates feature internal microchannels and are commonly used in liquid cooling systems for data centers and similar applications.
Application Areas: In electronics, widely used for cooling hardware such as computer CPUs and graphics cards. In the automotive industry, they are used in engine cooling systems. Additionally, they are applied in cooling systems for industrial equipment and medical devices such as CT scanners and MRI machines.
Manufacturing Process: The production process for copper heat sinks includes smelting, rolling, drawing, annealing, and other techniques. Through these processes, copper is shaped into required forms like copper tubes and fins. Components are then assembled into heat sinks via welding, fin insertion, and other methods.
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